|Back to list|
HD-1400S mold core repair polishing machine
This equipment is mainly used for the surface grinding and polishing of thin precision parts of non-metal and metal hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials. Immediate consultation details: 0755-89813868
表面粗糙度达0.4um以上，平面度0.008/100mm以内。 1. Main accuracy: surface roughness is above 0.4um, flatness is within 0.008 / 100mm.
该机床床身铸铁（或高钢焊接）工艺，材质好，强度高，稳定性好。 2. Machine tool material: The machine bed has cast iron (or high-steel welding) technology, good material, high strength, and good stability.
采用进口电器零部件，不受机械振动和电气干扰的影响并具有良好的防湿性。 3.Electrical system: It adopts imported electrical components, which is not affected by mechanical vibration and electrical interference and has good moisture resistance. Provides better grinding efficiency and a wider choice of grinding processes for grinding workpieces.
采用变频调速及全链轮传动，使整机工作时起动平稳、运转稳定，尤其在低速运转时，克服了研磨盘的窜动、爬行现象。 4. Grinding disc movement form: Adopting variable frequency speed regulation and full sprocket drive to make the whole machine start smoothly and run stably, especially when running at low speed, it overcomes the phenomenon of grinding disc creep and crawling.
采用双电机和双变频驱动，用主电机（11KW/1440r/min）带动研磨盘，副电机（4Kw/1440r/min）驱动内齿，均可调速。 5. Machine tool application power: adopts dual motor and dual frequency conversion drive, the main motor (11KW / 1440r / min) drives the grinding disc, and the auxiliary motor (4Kw / 1440r / min) drives the internal teeth, both of which can be adjusted in speed.
6. Equipped with grinding liquid stirring filtering system, which greatly improves the use rate of grinding liquid.
7. Innovation is the basic concept of design. In the design of this equipment, the structure, control, and functional characteristics of similar equipment at home and abroad have been carefully analyzed and compared, and the successful experiences and reasonable suggestions of many users have been synthesized, summarized and adopted. Efforts to improve the technical content of equipment, operating accuracy and smooth operation.
8. Please contact us for more specifications and grinding methods.
HD-1400S mold core repair polishing machining case:
Non-metallic and metallic hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials. (It is recommended to buy more equipment and send Hyde technology to the quantity; find Hyde to process it for less quantity.)
Note: As the technology is constantly updated, the above data is for reference only, and the actual data will prevail!
HD-1400S mold core repair polishing machine technical parameters
Grinding wheel specifications (mm)
Φ1400 * Φ380 * 45mm
380 / 220V
Speed of grinding disc
Internal tooth speed
Fixture ring specifications
Ф 610 * 80
Weight plate specifications
0.3 ≤b ≤200mm
0.008mm / 100mm
Surface roughness of workpiece surface
＜ Ra 0.4μm
Equipment approximate size (w * d * h) mm
2100 * 2100 * 1400mm