|Back to list|
High Precision Horizontal Thinning Machine
Hyde Precision Machinery Introduction
1. Hyde focuses on providing high-precision plane grinding equipment, plane polishing equipment and its grinding and polishing consumables; undertake processing.
2. Free proofing and trial grinding, free design of grinding and polishing solutions; Hyde's numerous grinding and polishing case advantages, and a better understanding of how to reduce costs and improve efficiency, can help enterprises achieve high benefits and low costs. Welcome to inquire for details: 0755-89813868
3. We don't just sell equipment, we also participate in the R & D and production of our customers. It is our goal to help our customers with efficient mass production.
Application range of high-precision horizontal thinner
This machine is very suitable for products with high hardness, thin thickness, and high precision processing requirements, such as LED sapphire substrates, optical glass wafers, quartz glass wafers, silicon wafers, ceramic wafers, tungsten steel wafers and other materials. High-speed reduction.
Introduction of High Precision Horizontal Thinning Machine
High-precision horizontal thinning machine, horizontal precision fast thinning machine is one of the key products of Shenzhen Hyde Precision Machinery Co., Ltd. Hyde has mature production technology, advanced production equipment, large sales quantity, wide range, good quality and good performance. , Is the preferred supplier of the majority of enterprises, factories, traders; the company has strong technical force, superb production technology, advanced detection methods, and thoughtful after-sales service. The purchase of horizontal thinners is based on Shenzhen Hyde and provides life-long maintenance! The sales network of horizontal thinners is spread all over the country. Welcome to inquire!
) Performance and parameters of high-precision horizontal thinner (Product pictures and parameters are for reference only. Hyde can provide a complete set of grinding solutions for free! Free proofing! To undertake processing! The cutting edge of Hyde's grinding process industry! For details, please call: 0755-89813868 )
1. The processing workpiece can be reduced to 0.02mm without breaking, and the parallelism and flatness can be controlled within the range of ± 0.002mm.
2. High book reduction efficiency. The LED sapphire substrate can reduce 50um per minute. The silicon wafer can reduce 250um per minute.
3. The series of horizontal book reduction machines adopt CNC program control system and PLC control panel.
Hyde provides a complete set of grinding solutions for free! Free proofing! Processing!
Hyde's cutting-edge grinding technology industry! For details, please call: 0755-89813868